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Packaging Research and Development Engineer Graduate Intern

Intel

This is a Full-time position in Phoenix, AZ posted May 1, 2021.

**Job Description**Assembly and Test Technology Development (ATTD) Experimental Mechanics Lab deals with thermo-mechanical challenges in the development of advanced packaging technologies.The personnel in this R&D lab use a variety of tools to study the behavior of electronic packages and their material constituents under different mechanical and/or thermal loading conditions: like dynamic warpage of packages using optics-based tools; interfacial adhesion strength using Double Cantilever Beam